| ．Conveyor-Type with reliable mechanism to provide high throughput and low wafer breakage . |
| ．Texture process for Multi-crystaline wafers . |
| ．Modular design on reaction and cleaning area . |
| ．Touch panel and easy-to-use UI operation system . |
| ．Customer side MES/CIM data connection optional . |
| ．Wafer size : 6”. |
| ．Wafer thickness : 160μm or thicker . |
| ．Equipment dimension : Approximately L8 x W2.1 x H2.1 ( m ) . |
| ．Process Optimization Support . |
| ．In-line process Monitor optional . |
