| ．
Fully automated system with high throughput and low wafer breakage rate . |
| ．Texture process for single-crystalline wafers . |
| ．Special wafer drying system . |
| ．Touch panel and easy-to-use UI operation system . |
| ．Customer side MES/CIM data connection optional . |
| ．Wafer size : 5”, 6”. |
| ．Wafer Thickness : 160μm or thicker. |
| ．Equipment Dimension : Approximately L11 x W2 x H2.5 ( m ) . |
| ．Process Optimization Support . |
| ．Off-line Process Monitor Support . |
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