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Home > Products > Other Equipments > Pre-Clean |
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Other Equipments > Pre-clean |
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| ．Batch-Type fully automated Wet bench . |
| ．Cleaning for hand mark and surface contamination . |
| ．Wafer size : 5”, 6” . |
| ．Wafer thickness : 160μm or thicker . |
| ．Equipment dimension Approx. L7.3 x W2 x H2.5 ( m ) . |
| ．Low wafer breakage . |
| ．High throughput . |
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